<aside> 👋 I am a PhD candidate at the Georgia Institute of Technology under the guidance of Professor Bakir, focusing on semiconductor manufacturing and 3D packaging. I graduated in Electronic and Materials Science Engineering at KAIST. I gained a significant interest in this field during an exchange program at Georgia Tech. I believe 3D packaging is a vital solution for the semiconductor industry’s future, offering substantial economic and performance advancements. My internship at SK Hynix’s High Bandwidth Memory department, where I was a scholarship recipient, deepened my expertise in this area. My ultimate ambition is to lead in the semiconductor field, inspired by Morris Chang, and to establish my own 3D packaging company.

</aside>

Education

Incheon Jinsan Science High School — Incheon, South Korea

Feb 2017 – Feb 2019

• Early graduation (completed in 2nd year)

KAIST (Korea Advanced Institute of Science and Technology) — Daejeon, South Korea

Mar 2019 – Aug 2025

• B.S. in Materials Science & Engineering and Electrical Engineering (Double Major)
• GPA: 3.94 / 4.3
• Academic Interests: Semiconductor fabrication, digital design, advanced packaging

Georgia Institute of Technology — Atlanta, GA, USA

Aug 2024 – Dec 2024

• Exchange Student, School of Electrical and Computer Engineering
• GPA: 4.0 / 4.0
• Research experience in Prof. Shimeng Yu’s lab (BSPDN thermal management)